Raymond Cook was Vice President of Engineering (retired) at Inductoheat Inc. He is a registered Professional Engineer in the State of Michigan, with a B.S. degree from Western Michigan University and M.B.A. from Wayne State University, Michigan. Mr. Cook’s credits include a great deal of "know-how" and he has been involved in the pioneering designs of high-, medium- and low-frequency solid state inverters, load matching equipment, machine and system designs, process control and monitoring systems for a wide variety of induction heating and heat treating applications including hardening, annealing, tempering, stress relieving, shrink fitting and many others. This includes the InductoScan Technology, which has become an acknowledged standard in modern induction scan hardening. Mr. Cook has been with Inductoheat for more than 36 years. He has written numerous technical publications including several chapters for various Handbooks.